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Enterprise 5G in aerospace factories will pick up now.
Week No.49
01-Dec-24 To 07-Dec-24

Curated Jobs - EIIRTrend

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  • : Q4(Oct-Nov-Dec), 2024

Yoto-Director of Hardware Engineering---(ID-110990) - IoT

  • : Q4(Oct-Nov-Dec), 2024

Tektronix-Hardware Engineering Spring 2025 Co-Op---(ID-110968) - IoT

  • : Q4(Oct-Nov-Dec), 2024

Swift Solar-Head of Hardware Engineering---(ID-110963) - IoT

  • : Q4(Oct-Nov-Dec), 2024

PQShield-Director of Hardware Engineering---(ID-110996) - IoT

  • : Q4(Oct-Nov-Dec), 2024

NXP Semiconductors-Principal Engineer - STA---(ID-110986) - IoT

  • : Q4(Oct-Nov-Dec), 2024

NXP Semiconductors-Graduate Automotive Radar Product Management---(ID-111005) - IoT

  • : Q4(Oct-Nov-Dec), 2024

NVIDIA-Hardware Engineering Mgr---(ID-110967) - IoT

  • : Q4(Oct-Nov-Dec), 2024

Microsoft-Hardware Engineering PM---(ID-110983) - IoT

  • : Q4(Oct-Nov-Dec), 2024

Microsoft-Hardware Engineering PM---(ID-110977) - IoT

  • : Q4(Oct-Nov-Dec), 2024

Microsoft-Hardware Engineering PM---(ID-110975) - IoT

  • : Q4(Oct-Nov-Dec), 2024

Google-Director of Engineering, Pixel Core, Board Support Package---(ID-110955) - IoT

  • : Q4(Oct-Nov-Dec), 2024

Element Materials Technology-General Manager- Digital Engineering (Aerospace/Energy)---(ID-110993) - IoT

  • : Q4(Oct-Nov-Dec), 2024

BAE Systems-Degree Apprentice Electronics Hardware Engineering---(ID-110999) - IoT

  • : Q4(Oct-Nov-Dec), 2024

PQShield-Director of Hardware Engineering---(ID-110790) - 5G

  • : Q4(Oct-Nov-Dec), 2024

Microsoft-Hardware Engineering PM---(ID-110828) - 5G

  • : Q4(Oct-Nov-Dec), 2024

Microsoft-Hardware Engineering PM---(ID-110825) - 5G

  • : Q4(Oct-Nov-Dec), 2024

Microsoft-Hardware Engineering PM---(ID-110814) - 5G

  • : Q4(Oct-Nov-Dec), 2024

Element Materials Technology-General Manager- Digital Engineering (Aerospace/Energy)---(ID-110787) - 5G

  • : Q4(Oct-Nov-Dec), 2024

Tata Motors-General Manager-Advanced Engineering---(ID-110580) - EV

  • : Q4(Oct-Nov-Dec), 2024

Tata Motors-Deputy General Manager-Advanced Engineering - EV-EV Engineering-TPEM---(ID-110576) - EV

  • : Q3(Jul-Aug-Sep), 2024

OmniOn Power-PLM & Engineering Tools Solution Architect--USA-(ID-110251) - PLM

  • : Q3(Jul-Aug-Sep), 2024

Accenture-Industry X - Engineering Digitization & PLM Manager--USA-(ID-110283) - PLM

  • : Q2(Apr-May-Jun), 2024

ZeroAvia-Engineering Software Support Specialist-UK--(ID-109495) - Industry 4.0 3D Printing Robotics

  • : Q2(Apr-May-Jun), 2024

Rich Products Corporation-Director, Engineering-USA--(ID-109508) - Industry 4.0 3D Printing Robotics

  • : Q2(Apr-May-Jun), 2024

Jedson Engineering-Warehouse Design and Automation Engineer-USA--(ID-109513) - Industry 4.0 3D Printing Robotics

  • : Q2(Apr-May-Jun), 2024

HORIBA-Automatisierungsingenieur / SPS Programmierer im Bereich Engineering-Germany--(ID-109519) - Industry 4.0 3D Printing Robotics

  • : Q2(Apr-May-Jun), 2024

Greencore-Engineering Stores and Inventory Programme Lead-UK--(ID-109496) - Industry 4.0 3D Printing Robotics

  • : Q2(Apr-May-Jun), 2024

Capgemini Engineering-Pre Sales Solutioner - Smart Factory-UK--(ID-109499) - Industry 4.0 3D Printing Robotics

  • : Q2(Apr-May-Jun), 2024

IBM-Platform Engineering Services Solution Architect-UK--(ID-109217) - IOT

  • : Q2(Apr-May-Jun), 2024

Spirent Communications-Field Engineering Lead-USA--(ID-109132) - 5G

  • : Q2(Apr-May-Jun), 2024

DISH Network-VP, Device Engineering-USA--(ID-109108) - 5G

  • : Q2(Apr-May-Jun), 2024

Ciena-Solutions Engineering and Introduction Engineer-UK--(ID-109098) - 5G

  • : Q1(Jan-Feb-Mar), 2024

Western Digital-VP, Information Technology--USA-(ID-108907) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Western Digital-Specialist 5, Technical Product Management--India-(ID-108883) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Vishay Intertechnology, Inc.-Process Engineer, semiconductor model Implantation, Hybrid, Itzehoe--GERMANY-(ID-108918) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Texas Instruments-DFT Lead--India-(ID-108884) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Synopsys Inc-R&D Engineering, Staff Engineer--India-(ID-108886) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Siemens-Senior Member Technical Staff--India-(ID-108893) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Samsung Semiconductor-Senior Director, Strategy and Corporate Development--USA-(ID-108910) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Samsung Semiconductor-Memory Supply Chain Specialist (f/m/d)--GERMANY-(ID-108919) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Qualcomm-Enigneer, Senior Staff--India-(ID-108878) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Oxford Instruments plc-Customer Support Engineer--India-(ID-108879) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

onsemi-Staff Analog Engineer--India-(ID-108881) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

NXP -Product Marketing Manager (AI and Machine Learning)--USA-(ID-108909) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Mitsubishi Chemical America-Market Sales Director- Semiconductor (1399)--USA-(ID-108904) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Micron Technology-R&D Metrology Process Development Engineer--USA-(ID-108897) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Meta-Research Scientist: Materials & Processes Innovation--USA-(ID-108894) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Mercedes-Benz AG-Facheinkufer Halbleiter (w/m/d)--GERMANY-(ID-108913) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Linxens-Semiconductor Commodity Buyer Manager--GERMANY-(ID-108916) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Lilium-Senior Equipment Engineer--GERMANY-(ID-108917) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

KLA-Senior Optics Designer--GERMANY-(ID-108915) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Intex Technologies (India) Ltd-Printed Circuit Board Designer--India-(ID-108891) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Intel-SOC Physical design Engineer--India-(ID-108880) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Intel-Module Development Engineer Thin Films--USA-(ID-108896) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Infineon Technologies-Staff Device Engineer - Semiconductor--USA-(ID-108906) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Elbit Systems of America-Principal Research Scientist - Atomic Layer Deposition (ALD)--USA-(ID-108895) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Doosan GridTech-Senior Technical Writer--USA-(ID-108899) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Carl Zeiss-Abteilungsleitung Coating Technology DUV (m/w/x)--GERMANY-(ID-108912) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Black Semiconductor-Head of PMO (f/m/d)--GERMANY-(ID-108920) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

AUDI-Praktikum - Technologieentwicklung Robotik--GERMANY-(ID-108911) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

ASML-Group Leader (m/f) Tool shop--GERMANY-(ID-108914) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Applied Materials Europe-Physicist / Engineer (m/f/d) Particle Beam Technology / Semiconductor Control--GERMANY-(ID-108921) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

Analog Devices-Semiconductor Process and Device Engineer--USA-(ID-108908) - Semiconductor Engineering

  • : Q1(Jan-Feb-Mar), 2024

AMD-Sr. Product Engineer--USA-(ID-108901) - Semiconductor Engineering

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